General Plasma offers advanced source components and complete vacuum thin film coating systems.

ADVANCED SOURCES FOR SPUTTERING AND ETCHING APPLICATIONS

Magnetrons: Unmatched uniformity, reliability and resource utilization

• Rotatables - High power, >80% target utilization, 3+ meters
• Planars (MMPM) - >60% utilization, high uniformity, low maintenance

Ion Sources: high etch rates, easy installation, 10x reduction in contamination

• ALS - Low cost, full featured sources up to 500mm
• PPALS - Industrial ion sources with etch rates up to 60nm-m/min

CUSTOM SYSTEMS

Large-area vacuum coating systems designed to meet your specifications.

• Roll to roll, rigid planar and shaped substrates
• Production and research systems
• Thin film process included
• Sputtering and PECVD

LARGE AREA PECVD SOLUTIONS

General Plasma’s revolutionary PECVD technologies provide high quality large area thin film coatings at a lower cost.

• High deposition rates - 10x reactive sputtering rates
• Optical quality uniformity
• Metal oxide and nitride films
• Complete turnkey solutions with process